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| Study on Electrodeposition Preparation of Copper Nanoparticles |
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Received:May 20, 2014
Revised:May 21, 2014
Accepted:May 22, 2014
Published Online:October 29, 2015
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| DOI： |
| KeyWord:Deep eutectic solvents；Constant cell voltage electrolysis；Copper nanoparticles |
| Author | Institution |
| WANG Rui |
Faculty of metallurgical and energy engineering,Kunming university of science and technology |
| HUA Yi-xin |
Faculty of metallurgical and energy engineering,Kunming university of science and technology |
| XU Cun-ying |
Faculty of metallurgical and energy engineering,Kunming university of science and technology |
| ZHOU Zhong-ren |
Faculty of metallurgical and energy engineering,Kunming university of science and technology |
| LIU Hai-Peng |
Faculty of metallurgical and energy engineering,Kunming university of science and technology |
| ZHAO Ji-wen |
Faculty of metallurgical and energy engineering,Kunming university of science and technology |
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| Abstract: |
| 【】 Copper nanoparticles (40 nm in diameter) were prepared by constant voltage electrolysis in the molar ratio of 2:1 urea-Choline Chloride (ChCl) based deep eutectic solvent with Cu(?) oxide (Cu2O) as precursor. The optimal experimental con -ditions of preparing copper nanoparticles by electrodeposition, which was deter -mined by single factor experiment and combined with scanning electron microscopy (SEM) analysis and current efficiency analysis, isthat: the cathode material is a nickel plate, the electrolyte temperature is 313K~323K, the cell voltage of 2.5V, the electrodeposition time is 2h. |
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